Custom-made assemblies in various sizes, powers and specifications,International Quality and Environment Management System,Low reflection and high light transmission glass and cell sheet surface cutting technology,High module efficiency through superior manufacturing technology.
16% average effective area conversion efficiency of mass production components, 1.7mm thick and 2kg/m2 heavy; Various sizes from 1.7m to 6m can be customized; The components are easy to install and directly pasted without additional fixing and perforation, and the ballast and BOS are greatly reduced; Embedded bypass diode minimizes shading attenuation and is applicable to distributed generation;
Higher efficiency ceilings, about 10% more power output per watt;Integrated thin film deposition technology, adjustable color/structure/transmittance;No hot spots/hidden cracks/PID, loads +2400Pa;Diversified and customizable, with a wider range of applications;Low industry chain investment, module costs are 50% lower;Lower carbon footprint, energy consumption is only 1/4 of crystalline silicon products.
Higher efficiency ceilings, about 10% more power output per watt;Integrated thin film deposition technology, adjustable color/structure/transmittance;No hot spots/hidden cracks/PID, loads +2400Pa;Diversified and customizable, with a wider range of applications;Low industry chain investment, module costs are 50% lower;Lower carbon footprint, energy consumption is only 1/4 of crystalline silicon products.
Higher efficiency ceilings, about 10% more power output per watt;Integrated thin film deposition technology, adjustable color/structure/transmittance;No hot spots/hidden cracks/PID, loads +2400Pa;Diversified and customizable, with a wider range of applications;Low industry chain investment, module costs are 50% lower;Lower carbon footprint, energy consumption is only 1/4 of crystalline silicon products.
Higher efficiency ceilings, about 10% more power output per watt;Integrated thin film deposition technology, adjustable color/structure/transmittance;No hot spots/hidden cracks/PID, loads +2400Pa;Diversified and customizable, with a wider range of applications;Low industry chain investment, module costs are 50% lower;Lower carbon footprint, energy consumption is only 1/4 of crystalline silicon products.
Higher efficiency ceilings, about 10% more power output per watt;Integrated thin film deposition technology, adjustable color/structure/transmittance;No hot spots/hidden cracks/PID, loads +2400Pa;Diversified and customizable, with a wider range of applications;Low industry chain investment, module costs are 50% lower;Lower carbon footprint, energy consumption is only 1/4 of crystalline silicon products.